Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211408 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Tomoaki Moriwaka, Takashi Ohtsuki | 2021-12-28 |
| 11101293 | Semiconductor device and method for manufacturing the semiconductor device | Ryota HODO, Motomu Kurata, Satoru Okamoto, Shunpei Yamazaki | 2021-08-24 |
| 11004727 | Method for fabricating electrode and semiconductor device | Motomu Kurata, Ryota HODO, Yuta Iida, Satoru Okamoto | 2021-05-11 |
| 10923580 | Semiconductor device and method for fabricating the same | Shunpei Yamazaki, Hideomi Suzawa, Motomu Kurata, Masashi TSUBUKU | 2021-02-16 |