Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211408 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Shinya Sasagawa, Takashi Ohtsuki | 2021-12-28 |
| 11211500 | Semiconductor device and method for manufacturing semiconductor device | Shunpei Yamazaki, Hiromi SAWAI, Ryo Tokumaru, Toshihiko Takeuchi, Tsutomu Murakawa +1 more | 2021-12-28 |
| 11004961 | Semiconductor device and method for manufacturing semiconductor device | Shunpei Yamazaki, Toshihiko Takeuchi, Naoto Yamade, Hiroshi Fujiki, Shunsuke Kimura | 2021-05-11 |