Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189582 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang | 2021-11-30 |
| 11177239 | Semiconductor device including control switches to reduce pin capacitance | Shineng Ma, Chih-Chin Liao, Ye Bai, Yazhou Zhang, Yanwen Bai +1 more | 2021-11-16 |
| 11031371 | Semiconductor package and method of fabricating semiconductor package | Tiger Tai, Ken Qian, C C Liao, Hem Takiar, Gursharan Singh | 2021-06-08 |
| 11031372 | Semiconductor device including dummy pull-down wire bonds | Han-Shiao Chen, Chih-Chin Liao | 2021-06-08 |
| 11031378 | Semiconductor device including high speed heterogeneous integrated controller and cache | Yazhou Zhang, Zengyu Zhou | 2021-06-08 |