Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031371 | Semiconductor package and method of fabricating semiconductor package | Chin-Tien Chiu, Tiger Tai, Ken Qian, C C Liao, Gursharan Singh | 2021-06-08 |
| 10930607 | Manufacturing process for separating logic and memory array | Michael Mostovoy, Emilio Yero, Gokul Kumar, Yan Li | 2021-02-23 |