Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189582 | Wire bond pad design for compact stacked-die package | Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu | 2021-11-30 |
| 11139277 | Semiconductor device including contact fingers on opposed surfaces | Chien-Te Chen, Cong Zhang, Hsiang Ju Huang, Yu Ying Tan, Han-Shiao Chen | 2021-10-05 |