Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2021-11-23 |
| 11075175 | Semiconductor package | Joo Hwan Jung, Jung Chul Gong, Yong Ho Baek, Young Sik Hur | 2021-07-27 |