Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Dae Jung Byun, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na +4 more | 2021-11-23 |
| 11075156 | Substrate having electronic component embedded therein | Dae Jung Byun, Yong-duk Lee, Ki Ho Na, Je Sang Park, Jin Won Lee | 2021-07-27 |
| 10903013 | Dielectric powder and multilayer capacitor using the same | Jin Woo Kim, Min Gi Sin, Byung Hyun Park, Chin Mo Kim | 2021-01-26 |