Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Jun Hyeong Jang, Ki Ho Na +4 more | 2021-11-23 |
| 10925163 | Printed circuit board | Je Sang Park | 2021-02-16 |