Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998303 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Seungjin Cheon, Bubryong Lee, Junglae Jung | 2021-05-04 |
| 10900883 | Mold test apparatus and method | Jung Lae Jung | 2021-01-26 |