Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998303 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Junglae Jung | 2021-05-04 |
BL
Bubryong Lee
Overall (2021): #509,192 of 548,734Top 95%
1
Patents 2021