Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998303 | Method of manufacturing package-on-package device and bonding apparatus used therein | Junho Cho, Ohchul Kwon, Tea-Geon Kim, Bubryong Lee, Junglae Jung | 2021-05-04 |
SC
Seungjin Cheon
Overall (2021): #269,590 of 548,734Top 50%
1
Patents 2021