Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081374 | Semiconductor package molding device and method of manufacturing semiconductor device | Hee-Ju Seo, Jae Won Choi, Young Jin Hwang | 2021-08-03 |
| 11011395 | Cover structure for a light source, light illuminating apparatus having the same | Young Sik Kim, Young-Hong Han, Young-Gon Hwang | 2021-05-18 |