Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081374 | Semiconductor package molding device and method of manufacturing semiconductor device | Jae Won Choi, Sung-Bok Hong, Young Jin Hwang | 2021-08-03 |
HS
Hee-Ju Seo
Overall (2021): #435,943 of 548,734Top 80%
1
Patents 2021