Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081374 | Semiconductor package molding device and method of manufacturing semiconductor device | Hee-Ju Seo, Jae Won Choi, Sung-Bok Hong | 2021-08-03 |
YH
Young Jin Hwang
Overall (2021): #200,241 of 548,734Top 40%
1
Patents 2021