Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069588 | Semiconductor package and method of manufacturing the same | Jun Young Oh, Hyun Ki Kim, Seung Hwan Kim, Yong Kwan Lee | 2021-07-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069588 | Semiconductor package and method of manufacturing the same | Jun Young Oh, Hyun Ki Kim, Seung Hwan Kim, Yong Kwan Lee | 2021-07-20 |