Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107769 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang | 2021-08-31 |
| 11069588 | Semiconductor package and method of manufacturing the same | Hyun Ki Kim, Sang-Soo Kim, Seung Hwan Kim, Yong Kwan Lee | 2021-07-20 |