Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11111377 | Resin composition | Seung Cheol Ryoo, Sung Hwan Yoon, Seong Lyong Kim, Jin Oh Nam | 2021-09-07 |
| 11069588 | Semiconductor package and method of manufacturing the same | Jun Young Oh, Sang-Soo Kim, Seung Hwan Kim, Yong Kwan Lee | 2021-07-20 |