Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11186742 | Sealing resin composition, electronic component device, and method of manufacturing electronic component device | Yuma Takeuchi, Yoshihito Inaba | 2021-11-30 |
| 11059966 | Liquid epoxy resin composition for sealing, and electronic component device | Naoyuki Nojiri, Makoto Kunimi, Kohji Hori | 2021-07-13 |