KH

Kohji Hori

SC Showa Denko Materials Co.: 1 patents #38 of 158Top 25%
Overall (2021): #371,018 of 548,734Top 70%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11059966 Liquid epoxy resin composition for sealing, and electronic component device Naoyuki Nojiri, Hisato Takahashi, Makoto Kunimi 2021-07-13