Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11186742 | Sealing resin composition, electronic component device, and method of manufacturing electronic component device | Hisato Takahashi, Yoshihito Inaba | 2021-11-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11186742 | Sealing resin composition, electronic component device, and method of manufacturing electronic component device | Hisato Takahashi, Yoshihito Inaba | 2021-11-30 |