Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11088090 | Package comprising a substrate that includes a stress buffer layer | Sebastian Brunner, Kurt Wiesbauer, Horst Uwe FAULHABER, Andreas Haas, Franz Tinauer +2 more | 2021-08-10 | $26,900,000 |