Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088090 | Package comprising a substrate that includes a stress buffer layer | Kurt Wiesbauer, Horst Uwe FAULHABER, Florian RAK, Andreas Haas, Franz Tinauer +2 more | 2021-08-10 |