{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2021", "item": "https://www.patentleaderboard.com/2021/"}, {"@type": "ListItem", "position": 3, "name": "Qualcomm", "item": "https://www.patentleaderboard.com/2021/company/qualcomm"}, {"@type": "ListItem", "position": 4, "name": "Andreas Haas", "item": "https://www.patentleaderboard.com/2021/inventor/fl:an_ln:haas-5"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Andreas Haas — 1 Patent in 2021

Qualcomm: 1 patents #789 of 1,914Top 45%
Wolfsberg, AT: #3 of 14 inventorsTop 25%
Overall (2021): #531,471 of 548,734Top 100%
1 Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11088090 Package comprising a substrate that includes a stress buffer layer Sebastian Brunner, Kurt Wiesbauer, Horst Uwe FAULHABER, Florian RAK, Franz Tinauer +2 more 2021-08-10 $26,900,000