Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Jinbang Tang, Betty Hill-Shan Yeung, Michael B. Vincent | 2021-09-14 |
| 11031681 | Package integrated waveguide | Michael B. Vincent, Scott M. Hayes, Stephen R. Hooper, Pascal Oberndorff, Walter Parmon | 2021-06-08 |
| 10937750 | Low stress pad structure for packaged devices | Paul Southworth | 2021-03-02 |