Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Jinbang Tang, Zhiwei Gong, Michael B. Vincent | 2021-09-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Jinbang Tang, Zhiwei Gong, Michael B. Vincent | 2021-09-14 |