Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Zhiwei Gong, Betty Hill-Shan Yeung, Michael B. Vincent | 2021-09-14 |
| 11101542 | Integrated radio package having a built-in multi directional antenna array | — | 2021-08-24 |