Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189548 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Choon Kuan Lee, Chin Hui Chong | 2021-11-30 |
WT
Wuu Yean Tay
Overall (2021): #210,233 of 548,734Top 40%
1
Patents 2021