Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11189548 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay | 2021-11-30 | $26,919,000 |