Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189548 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Choon Kuan Lee, Wuu Yean Tay | 2021-11-30 |
CC
Chin Hui Chong
Overall (2021): #503,545 of 548,734Top 95%
1
Patents 2021