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USPTO Patent Rankings Data through Sept 30, 2025
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Tony M. Lindenberg — 1 Patent in 2021

Micron: 1 patents #714 of 1,451Top 50%
Boise, ID: #335 of 667 inventorsTop 55%
Idaho: #511 of 1,226 inventorsTop 45%
Overall (2021): #228,528 of 548,734Top 45%
1 Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11094684 Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography Chandra S. Tiwari, Jonathan S. Hacker, Christopher J. Gambee, Kurt J. Bossart 2021-08-17