Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094684 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Christopher J. Gambee, Kurt J. Bossart | 2021-08-17 |
| 11004697 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2021-05-11 |
| 10896886 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari | 2021-01-19 |