Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094684 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Jonathan S. Hacker, Kurt J. Bossart | 2021-08-17 |
| 10923478 | Reduction of roughness on a sidewall of an opening | Devesh Dadhich Shreeram, Irina Vasilyeva | 2021-02-16 |
| 10896886 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari | 2021-01-19 |