Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11150080 | Thickness measurement apparatus, thickness measurement method, and thickness measurement program | Gyung Hwan OH, Deok Joong Kim, Dong Woon PARK | 2021-10-19 |
| 10995153 | Polypeptide selectively binding to immunoglobulin G of mouse or rabbit and use thereof | Sukyo Jeong, Woosung Heu, Jong Won Kim, Joong-Jae Lee | 2021-05-04 |