Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160164 | Wiring substrate | Takenobu Nakamura, Takahiro Yamazaki, Toshihide Makino | 2021-10-26 |
| 11116080 | Wiring substrate | Takenobu Nakamura, Takahiro Yamazaki, Toshihide Makino | 2021-09-07 |
| 11036140 | Substrate processing apparatus, substrate processing method and recording medium | Shinichiro KAWAKAMI, Hiroshi Mizunoura, Yohei SANO, Masashi Enomoto | 2021-06-15 |
| 10986729 | Wiring substrate | Takenobu Nakamura, Takahiro Yamazaki, Toshihide Makino | 2021-04-20 |
| 10945334 | Wiring substrate | Takenobu Nakamura, Takahiro Yamazaki, Toshihide Makino | 2021-03-09 |