Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | John Hon-Shing Lau, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang | 2021-10-12 |