Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024586 | Semiconductor device package and method of manufacturing the same | Chia-Hao Sung, Hsuan-Yu Chen | 2021-06-01 |
| 11004734 | Metal-based etch-stop layer | Szu-Ping Tung, Jen Hung Wang, Shing-Chyang Pan | 2021-05-11 |