Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171119 | Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire | Kyungseon Hwang, Jinchan Ahn | 2021-11-09 |
WK
Wonyoung Kim
Overall (2021): #210,864 of 548,734Top 40%
1
Patents 2021