Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168406 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Vincent Paneccasio, Jr., Kyle Whitten, Ivan Li | 2021-11-09 |
| 11124888 | Copper deposition in wafer level packaging of integrated circuits | Kyle Whitten, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise | 2021-09-21 |