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Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump |
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Resist structure for forming bumps |
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| 11112570 |
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump |
Toyohiro Aoki, Eiji Nakamura, Masao Tokunari |
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| 10991685 |
Assembling of chips by stacking with rotation |
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| 10930609 |
Method of forming a solder bump structure |
Toyohiro Aoki, Eiji Nakamura |
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