Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11181704 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Takashi Hisada, Eiji Nakamura, Masao Tokunari | 2021-11-23 |
| 11164845 | Resist structure for forming bumps | Eiji Nakamura, Takashi Hisada, Risa Miyazawa | 2021-11-02 |
| 11112570 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Takashi Hisada, Eiji Nakamura, Masao Tokunari | 2021-09-07 |
| 10991685 | Assembling of chips by stacking with rotation | Takashi Hisada, Eiji Nakamura | 2021-04-27 |
| 10930609 | Method of forming a solder bump structure | Takashi Hisada, Eiji Nakamura | 2021-02-23 |