Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164845 | Resist structure for forming bumps | Eiji Nakamura, Toyohiro Aoki, Takashi Hisada | 2021-11-02 |
| 11004819 | Prevention of bridging between solder joints | Takahito Watanabe, Hiroyuki Mori, Keishi Okamoto | 2021-05-11 |
| 10903526 | Electron device stack structure | Kuniaki Sueoka, Akihiro Horibe | 2021-01-26 |