Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114308 | Controlling of height of high-density interconnection structure on substrate | Akihiro Horibe, Hiroyuki Mori | 2021-09-07 |
| 11004819 | Prevention of bridging between solder joints | Risa Miyazawa, Takahito Watanabe, Hiroyuki Mori | 2021-05-11 |