Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018121 | Semiconductor packages | Sangnam JEONG, IlJoon Kim | 2021-05-25 |
| 10985138 | Semiconductor package having a plurality of chips and method of manufacturing the same | Won Young Kim | 2021-04-20 |
| 10943881 | Semiconductor package | Ae-Nee Jang, Kyungseon Hwang | 2021-03-09 |