Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160165 | Component carrier with through hole extending through multiple dielectric layers | Mikael Tuominen, Seok Kim Tay, Robin Zhang | 2021-10-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160165 | Component carrier with through hole extending through multiple dielectric layers | Mikael Tuominen, Seok Kim Tay, Robin Zhang | 2021-10-26 |