Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211317 | Component carrier comprising a component having vertical through connection | — | 2021-12-28 |
| 11160165 | Component carrier with through hole extending through multiple dielectric layers | Seok Kim Tay, Sally Sun, Robin Zhang | 2021-10-26 |
| 11116083 | Electronic component embedded by laminate sheet | Annie Tay | 2021-09-07 |
| 11083081 | Electronic package comprising a decoupling layer structure | Seok Kim Tay | 2021-08-03 |
| 11051391 | Thermally highly conductive coating on base structure accommodating a component | Annie Tay, Artan Baftiri | 2021-06-29 |
| 10939548 | Component carrier with improved toughness factor | Artan Baftiri | 2021-03-02 |