Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160165 | Component carrier with through hole extending through multiple dielectric layers | Mikael Tuominen, Sally Sun, Robin Zhang | 2021-10-26 |
| 11083081 | Electronic package comprising a decoupling layer structure | Mikael Tuominen | 2021-08-03 |
| 11039535 | Manufacturing holes in component carrier material | Abderrazzaq Ifis, Haina Wu | 2021-06-15 |
| 10966318 | Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric | Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou | 2021-03-30 |