Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081416 | Configuring a sealing structure sealing a component embedded in a component carrier for reducing mechanical stress | Wolfgang Schrittwieser, Christian Vockenberger | 2021-08-03 |
| 11051403 | Overhang-compensating annular plating layer in through hole of component carrier | — | 2021-06-29 |
| 11039535 | Manufacturing holes in component carrier material | Seok Kim Tay, Haina Wu | 2021-06-15 |
| 11013119 | Component carrier with deformed layer for accommodating component | — | 2021-05-18 |
| 10950463 | Manufacturing trapezoidal through-hole in component carrier material | — | 2021-03-16 |