Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121149 | Three-dimensional memory device containing direct contact drain-select-level semiconductor channel portions and methods of making the same | Hiroyuki Tanaka, Akihisa SAI | 2021-09-14 |
| 10957680 | Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same | Shinsuke Yada, Masanori Tsutsumi, Yuji Fukano, Akio Nishida, Christopher J. Petti | 2021-03-23 |
| 10943917 | Three-dimensional memory device with drain-select-level isolation structures and method of making the same | Takaaki Iwai, Makoto Koto, Ching-Huang Lu, Wei Zhao, Yanli Zhang +1 more | 2021-03-09 |