Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10899604 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Christian Geissler, Claus Waechter, Bernhard Winkler | 2021-01-26 |