Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145577 | Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus | Sonja Koller, Georg Seidemann, Bernd Waidhas | 2021-10-12 |
| 11037855 | Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus | Sonja Koller | 2021-06-15 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more | 2021-05-25 |